Laboratory Products
New Fast-Dissolving Material for Immediate Release Coating Introduced
Nov 04 2019
Merck has launched its Parteck® COAT excipient, a new functional material designed for immediate release film coating applications. Parteck® COAT is a particle engineered polyvinyl alcohol (PVA) with a unique particle structure that enables rapid dissolution even at low temperatures leading to an increased process efficiency.
Merck is the only supplier to offer a fast-dissolving PVA for coating applications. The water-soluble particle offers reliable batch-to-batch consistency, contributing to the quality and performance of the final drug product.
Parteck® COAT offers low viscosity in solution, even at high concentrations of 20%, leading to higher efficacy. Compared with existing PVAs for coating applications, Parteck® COAT has the potential to double the polymer concentration and cut the process time in half along with the following advantages: a stable moisture barrier to improve stability of moisture-sensitive drug substances; excellent surface finishing to increase the value of drug formulations; a high concentration of spraying liquid to increase coating efficacy.
Parteck® COAT is compliant with and surpasses the requirements of all major pharmacopoeias, including United States Pharmacopoeia (USP), European Pharmacopoeia (Ph. Eur.), Chinese Pharmacopoeia (ChP) and Japanese Pharmaceutical Excipients (JPE).
The new excipient will be incorporated into Merck’s Emprove® program. This program provides customers instant, online access to regulatory and technical information about the excipient and more than 400 other chemicals, as well as filters and single-use components to facilitate risk assessment and qualification processes.
More information online
Digital Edition
ILM 49.5 July
July 2024
Chromatography Articles - Understanding PFAS: Analysis and Implications Mass Spectrometry & Spectroscopy Articles - MS detection of Alzheimer’s blood-based biomarkers LIMS - Essent...
View all digital editions
Events
ACS National Meeting - Fall 2024
Aug 18 2024 Denver, CO, USA
Aug 25 2024 Copenhagen, Denmark
Aug 28 2024 Phnom Penh, Cambodia
Sep 04 2024 Chiba, Tokyo, Japan
Sep 04 2024 University of Warwick, Coventry, UK